发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION AND CURED PRODUCTS THEREOF |
摘要 |
<p>A photosensitive resin composition and cured products thereof are provided to prevent the bending due to heating in a process of manufacturing the flexible substrate and post-process or a parts-mounting process, and to show high-sensitivity even if the photopolymerization initiator is added in a small quantity. A photosensitive resin composition comprises carboxyl group-containing resin 100.0 parts by mass; an oxime ester-based photopolymerization initiator 0.1 ~ 1.5 parts by mass, represented by the chemical formula I; and a compound containing two ethylenically unsaturated groups in molecule. The photosensitive resin composition can be developed with the diluted alkali water solution.</p> |
申请公布号 |
KR20090033803(A) |
申请公布日期 |
2009.04.06 |
申请号 |
KR20080095885 |
申请日期 |
2008.09.30 |
申请人 |
TAIYO INK MFG. CO., LTD. |
发明人 |
SHIBASAKI YOKO;ARIMA MASAO;YONEDA KAZUYOSHI |
分类号 |
G03F7/028;G03F7/004;G03F7/027 |
主分类号 |
G03F7/028 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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