| 摘要 |
A wafer cleaning and processing apparatus is provided to clean the upper and lower side of wafer in one chamber at the same time by forming the settling portion holding wafer on the head-space of chamber. The inside of chamber(100) comprises a head-space(102) and a down space(104). The plasma cleaning process is performed at the head-space. The plasma cleaning process is performed at the down space. A remote plasma generator is formed at the bottom side which is connected to the down space of the chamber. The remote plasma generator generates the remote plasma which is supplied to the wafer. Opening and shutting device(106) connected to head-space is formed in the one-side wall of the chamber. The import/export operation of wafer is performed by the opening and shutting device. The settling portion is formed in the head-space.
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