RADIANT HEAT STRUCTRE FOR PIN TYPE POWER LED

摘要

A heat radiating structure for a pin type power LED is provided to effectively release the heat generated through the first lead frame connected to the LED device by setting up the radiating unit in the space between a molding unit of substrate and the LED. An LED device(1) is settled on the settling portion extended to the first lead frame. The LED device supplies the power through a lead from the outside. A stopper(4) is formed at one end of leads(5,5') of two lead frames(7,6). A radiating unit(10) is installed in the formed space between a molding unit(8) and a substrate(3) of LED. The radiating unit delivers the heat generated from the LED device to the lead of the first lead frame. The delivered heat is delivered to the radiating unit contacted with the lead.