| 发明名称 |
CMP PROCESS AND USE OF CMP SLURRY COMPRISNG ALUMINA POWDER AND ENGINEERED ABRASIVE |
| 摘要 |
CMP processes and products employ aluminas comprising alpha alumina particles having a particle width of less than 50 nanometers and a surface area of at least 50 m2/gm. |
| 申请公布号 |
HK1050913(A1) |
申请公布日期 |
2009.04.03 |
| 申请号 |
HK20030103083 |
申请日期 |
2003.04.30 |
| 申请人 |
SAINT-GOBAIN CERAMICS & PLASTICS, INC. |
发明人 |
GARG AJAY K.;TANIKELLA, BRAHMANANDAM V.;DELANEY, WILLIAM R. |
| 分类号 |
B24B37/00;C01F7/44;C09G;C09G1/02;C09K;C09K3/14;H01L;H01L21/304;H01L21/321 |
主分类号 |
B24B37/00 |
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