| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor apparatus which is easily manufactured and further reduces its internal resistance, and to provide a method of manufacturing the same. <P>SOLUTION: The semiconductor apparatus includes: a semiconductor device 3; a lead 4 having an electrode connected to an electrode formed on the semiconductor device 3; and a strap member 5 covering a metal film for electrically connecting the electrode of the semiconductor device 3 to the electrode of the lead 4. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
