发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing apparatus that can transfer a substrate to a processing section with high positioning accuracy. SOLUTION: A transfer robot TR1 transfers a substrate W from cooling units provided at heat treatment towers 22, 23 to coating treatment units provided at a first ground coating treatment section 21 and a second ground coating treatment section 121. On the other hand, a transfer robot TR2 transfers the substrate W from cooling units provided at heat treatment towers 32, 33 to coating treatment units provided at a resist coating treatment section 31 and a resist cover film coating treatment section 131. The cooling units are provided with positioning mechanisms, which align a position of the substrate W within a horizontal plane with a reference position. Suction transfer arms on the transfer robots TR1 and TR2 perform suction holding of the substrate W aligned with the reference position for transfer to the coating treatment units, thereby allowing the substrate W to be carried in with high positioning accuracy. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009071008(A) 申请公布日期 2009.04.02
申请号 JP20070237438 申请日期 2007.09.13
申请人 SOKUDO:KK 发明人 HAMADA TETSUYA
分类号 H01L21/68;B65G49/07;H01L21/027 主分类号 H01L21/68
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