| 摘要 |
Embodiments are described for arbitrating stacked dies in multi-die semiconductor packages. In one embodiment, die identification data for at least two stacked dies are arbitrated to select one of the dies as the primary die and the other as secondary. Each die includes an input/output buffer that drives an output signal to a commonly shared output terminal in response to receiving a die identification data bit as the input signal. Each die also includes an arbitration circuit that generates a control signal in response to the identification bit of one die being mismatched to a corresponding identification bit of the other die. The control signal programs a stack enable fuse in accordance with the arbitration to designate one of the dies as the secondary die.
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