| 摘要 |
A microphone apparatus includes a carrier chip and a microphone chip. The carrier chip includes a substrate with parallel top and bottom surfaces, a metallization layer overlying the top surface, and a cylindrical cavity that is bored through the top surface and the metallization layer and partially through the carrier substrate. The microphone chip includes a substrate with parallel top and bottom surfaces, a cylindrical cavity extending from the microphone substrate top surface to the microphone substrate bottom surface, and a diaphragm attached to the microphone substrate bottom surface and extending across the microphone cavity. The microphone chip is fixed to the carrier chip, with the microphone cavity overlying the carrier cavity, and the diaphragm covering the carrier cavity and electrically connected to the metallization layer.
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