| 摘要 |
<p>PURPOSE: A film substrate for a semiconductor package and a manufacturing method thereof are provided to be capable of preventing the warpage of the film substrate and improving an inspection process by using a metal layer. CONSTITUTION: A film substrate for a semiconductor package is provided with a base film(31), a metal pattern(32) formed at the upper portion of the base film for being connected with a semiconductor chip, and a metal layer(33) formed at the predetermined lower portion of the base film for being electrically connected with the outside and compensating the intensity of the base film. Preferably, the metal pattern and the metal layer contain at least Cu. Preferably, the metal layer is electrically connected with the metal pattern.</p> |
