POSITIVE-TYPE PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION

摘要

[PROBLEMS] To provide a positive-type photosensitive polyimide composition which enables the processing of a fine pattern, can form a coating film having excellent heat resistance and a linear expansion coefficient proximal to that of a substrate, does not need the imidation at a high temperature, does not deteriorate any electrical property, resolution property or the like, and enables to form a heat-resistant resin film. [MEANS FOR SOLVING PROBLEMS] Disclosed is a positive-type photosensitive polyimide resin composition comprising: a polyimide resin that has a specific skeleton and is soluble in an organic solvent; and a compound (b) that can generate an acid upon being irradiated with an active ray.