HIGH FREQUENCY MODULE AND WIRING BOARD

摘要

A high frequency module comprises a wiring board having a dielectric substrate, a line conductor formed on the first surface of the dielectric substrate, and a first ground conductor layer formed on the second surface facing the first surface of the dielectric substrate and provided with a first opening and a second opening on the periphery of the first opening, and a waveguide tube connected with the second surface, while having an opening facing the first opening and electromagnetically coupled with the line conductor. The wiring board has a vertical choke portion at least a part of which extends in the direction perpendicular to the second surface from the second opening. Furthermore, a horizontal choke portion is formed between the opening of the waveguide tube and the second opening along the second surface between the wiring board and the waveguide tube.