| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can correspond to a reduction in pad size and prevent a deterioration in connection reliability such as short between pins. <P>SOLUTION: Before ultrasonic thermocompression bonding of a metal thin wire 7 to an electrode 2, a deformed metal ball 9a shifted from the center of the metal thin wire 7 is formed by elastically deforming the metal ball 9 formed on the leading end of the metal thin wire 7 by pushing the ball to an inclined surface 12a having an inclined pushing surface and a metal connection portion 10a is formed by performing ultrasonic thermocompression bonding of the deformed metal ball 9a to the electrode 2. <P>COPYRIGHT: (C)2009,JPO&INPIT |
