| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a piezoelectric thin film vibrator for simplifying processes and eliminating the risk of damaging an element surface. <P>SOLUTION: At first, recessed parts are formed in positions equivalent to a cavity and a conductive line for extraction on one surface side of a substrate, and a conductive material is buried inside the recessed parts. Then, the other surface side of the substrate is removed so as to expose the conductive material inside the respective recessed parts, through-holes filled with the conductive material are formed, and a lower electrode pattern, a piezoelectric thin film and an upper electrode pattern are formed on the substrate. Thereafter, a mask in which the part equivalent to the through-hole formed in a position corresponding to the laminate is opened, is formed, etching is performed using the mask, the conductive material exposed from the mask is removed and the cavity is formed. <P>COPYRIGHT: (C)2009,JPO&INPIT |
