LIGHT EMITTING DIODE PACKAGE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a light emitting diode package which can minimize a deviation of chromaticity coordinates and can be made thinner.

SOLUTION: The light emitting diode package includes: a phosphor substrate 110 which can be constituted of a glass substrate containing phosphor or having phosphor applied; an LED chip 120 which is mounted on the phosphor substrate 110; a circuit board 130 which is mounted in an area on the phosphor substrate 110 except an area for mounting of the LED chip 120; an electrode connection part 140 which carries an electric current to the LED chip 120 and the circuit board 130; and a sealing member 150 which can be made of transparent epoxy or silicon and covers the LED chip 120, the circuit board 130, and the phosphor substrate 110.

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