| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package for a light emitting diode comprising at least a substrate molded integrally inside a reflection frame, an opening portion molded in the substrate, a reed-shaped mounting substrate fitted in the opening portion, and a reed-shaped connection metal substrate. <P>SOLUTION: The package for the light emitting diode comprises: a ceramic main body having the reflection frame and substrate molded in one body; and the reed-shaped metal substrate. The ceramic main body comprises: the reflection frame; and the substrate molded inside the reflection frame in one body. The substrate is provided with at least two opening portions in the reflection frame. The two opening portions are disposed opposite to each other, and a recessed groove is formed which communicates from a reverse surface of the frame body to a lower-side end. The reed-shaped metal substrate is fitted in the respective opening portions and recessed groove, and to the lower-side end. <P>COPYRIGHT: (C)2009,JPO&INPIT |
