| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the accuracy of the conveyance position of a semiconductor wafer W with respect to a loading panel 32. <P>SOLUTION: The shock-absorbing desk is provided with a base mount 2; a loading panel 32 for loading a wafer stage 31 on which the semiconductor wafer W is laid; a plurality of spring elements 4 provided on the base mount 2 and support the loading panel 32 and remove the vibration of the loading panel 32; and a positioning mechanism 5 which makes the vibration removing the functions of the spring element 4 ineffective, when semiconductor wafer W is mounted on the wafer stage 31 and position the loading panel 32, at a predetermined position with respect to the base mount 2. <P>COPYRIGHT: (C)2009,JPO&INPIT |
