| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and a substrate processing method that prevent operation failure and processing failure because of liquid adhering to a substrate in an aligner. <P>SOLUTION: After the substrate W is cleaned, a liquid supply nozzle 650 discharges a rinse liquid and moves toward the outside from above the center of the substrate W while the substrate W is rotated. In this case, a dry region R1 with no rinsing liquids is expanded on the substrate W. When the liquid supply nozzle 650 moves above the periphery of the substrate W, the rotational speed of the substrate W decreases. The traveling speed of the liquid supply nozzle 650 is maintained as it is. Then, rinse liquid discharge is stopped and the liquid supply nozzle 650 moves to the outside of the substrate W. As a result, the dry region R1 spreads onto the substrate W entirely, thus drying the substrate W. <P>COPYRIGHT: (C)2009,JPO&INPIT |
