发明名称 |
Wafer-level image sensor module, method of manufacturing the same, and camera module |
摘要 |
Provided is a wafer-level image sensor module including a wafer; an image sensor mounted on the wafer; a transparent member installed above the top surface of the wafer so as to seal the image sensor; a plurality of vias formed in the wafer so as to be positioned outside the transparent member; a plurality of upper pads formed on the upper ends of the respective vias; an encapsulation portion formed on the top surface of the wafer so as to be positioned outside the transparent member; and a plurality of external connection members that are electrically connected to the lower ends of the respective vias.
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申请公布号 |
US2009085134(A1) |
申请公布日期 |
2009.04.02 |
申请号 |
US20080007977 |
申请日期 |
2008.01.17 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
PARK SEUNG WOOK;YUAN JING LI;HONG JU PYO;YANG SI JOONG |
分类号 |
H01L31/0232;H01L21/52 |
主分类号 |
H01L31/0232 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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