MULTI-DIRECTIONAL TRENCHING OF A DIE IN MANUFACTURING SUPERJUNCTION DEVICES

摘要

A method of manufacturing a super junction device includes providing a semiconductor wafer having at least one die (220a). At- least one first trench (222a) having a first orientation is formed in the at least one die. At least one second trench having a second orientation that is different from the first orientation is formed in the at least one die.