ALUMINUM NITRIDE SINTERED COMPACT, AND SUBSTRATE MOUNTING DEVICE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an aluminum nitride sintered compact whose total emissivity at high temperature is high, and which is suitable for a substrate mounting device, and to provide a substrate mounting device having low particle properties, and having sufficient heat responsibility even in a high temperature region.

SOLUTION: Disclosed is a substrate mounting device using an aluminum nitride sintered compact whose total emissivity at 200°C is ≥60%. Also disclosed is a substrate mounting device comprising: a substrate provided with an exothermic resistor; and a projecting part formed at the surface of the substrate, and the total emissivity at 200°C in the substrate is ≥60%.

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