| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a die bonding paste for use of a light-emitting diode, which suffers a small change with time under high temperature environments and gives a hardened substance excellent in heat resistance and durability. <P>SOLUTION: The die bonding paste for use of a light-emitting diode contains: (A) a liquefied reactant including (a-1) glycidylamine-type liquefied epoxy resin and (a-2) bismaleimide-group-containing polyimide resin of a number average molecular weight of 200-10,000 which are thermally reacted at a temperature of 120-220°C for 0.5-5 hours; (B) an amine-based hardening agent, (C) a conductive filler; (D) an imidazole-based hardening accelerator; and (E) a reactive diluent and/or organic solvent. <P>COPYRIGHT: (C)2009,JPO&INPIT |
