| 摘要 |
PROBLEM TO BE SOLVED: To provide a tool for a semiconductor wafer which can eliminate risks that an adhesive of a masking layer is peeled by deterioration, the peeling of the masking layer is disturbed, and the adhesive remains; and to provide a plating method for the semiconductor wafer. SOLUTION: A semiconductor wafer is subjected to a smoothing treatment to obtain a smooth masking surface, and then a masking layer 12 of the tool 10 for semiconductor wafer is closely adhered onto the smooth masking surface. The semiconductor wafer 1 on which the masking layer 12 is closely adhered is subjected to a pre-treatment and then subjected to a plating treatment. Thereafter, the plated semiconductor wafer 1 is transferred, stored or picked up in such a state that the masking layer 12 is closely adhered on the masking surface. The masking layer 12 is made of an olefin-based elastomer, and the surface 13 to be adhered to the masking surface of the semiconductor wafer of the elastomer is subjected to a mirror treatment. The masking surface of the semiconductor wafer can be protected by the close adhesion of the masking layer 12 as long as a volume change does not occur because the masking layer 12 made of an elastomer is used. COPYRIGHT: (C)2009,JPO&INPIT
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