| 摘要 |
A method of forming a pin adapted to be used in a PGA joint, and a flattening head used to perform the method. The method includes: providing a pin blank; and forming a pin head by coining an end of the pin blank using a flattening head thereby forming the pin, the pin having a pin stem and the pin head attached to the pin stem, the flattening head being shaped to impart a topography to an underside surface to the pin head that is non-smooth during coining, the topography being adapted to allow gases to escape from a pin-attach solder disposed adjacent to the underside surface.
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