| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable multilayer printed wiring board, in which electrical connection can be made directly with an IC chip without going through the mediary of a lead component. SOLUTION: The IC chip 20 is contained in a recess 32 formed, in a core substrate 30 via filler resin 34. By reducing the stress caused by the difference in thermal expansion between the IC chip 20, the core substrate 30 is relaxed by the filler resin 34, thus protecting an interlayer insulation layer 50 against stripping or cracking. |
