发明名称 METHOD FOR FORMING CONDUCTIVE FILM PATTERN
摘要 PROBLEM TO BE SOLVED: To provide a method for forming a conductive film pattern which can form a micro conductive film pattern accurately without using a deposition process in a vacuum or a photolithography method. SOLUTION: After a wettability pattern comprising a high wettability region which is high in wettability relative to an ink for a conductive film and a low wettability region having low wettability is formed on a substrate, the ink for the conductive film is coated by an ink jet system to form the conductive film on the high wettability region. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009071037(A) 申请公布日期 2009.04.02
申请号 JP20070237850 申请日期 2007.09.13
申请人 KONICA MINOLTA HOLDINGS INC 发明人 TSUZUKI SAIICHI
分类号 H05K3/12;G02F1/1343;G09F9/30;H05K3/10;H05K3/18 主分类号 H05K3/12
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