| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a printed wiring board which reduces a size difference in height of a conductor pattern to ensure a necessary top size of the conductor pattern while narrowing gaps between conductive pattern portions, thus improves circuit reliability and circuit performance. SOLUTION: By the manufacturing method for the printed wiring board, a conductive layer formed on an insulating substrate is etched to form the conductive pattern. In the middle of etching of the conductive layer, the side wall of an etched portion is masked to carry out further etching to form the conductive pattern. COPYRIGHT: (C)2009,JPO&INPIT
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