| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device capable of inexpensively improving the bondability of lead-free solder to ensure adhesion with mold resin in mounting a semiconductor chip on a copper substrate via the lead-free solder for packaging, and the semiconductor device. SOLUTION: The manufacturing method of the semiconductor device 20 includes a step of forming primer layers 23A and 23 on the surface of a flat substrate 21, a step of shaping the substrate into a curve so that the mounting surface of a semiconductor chip 22 is concave, a step of grinding the concave mounting surface to be flat so that the primer layer 23 remains in a semiconductor chip located region to form the exposed surface of the substrate, a step of locating the semiconductor chip 22 via solder 24 on the primer layers, and a step of heating the whole of the device containing the substrate and the semiconductor chip, joining the semiconductor chip on the primer layers of the substrate via the solder, and warping the substrate to make its front face convex and form the rear face of the substrate to be a flat face 21b. COPYRIGHT: (C)2009,JPO&INPIT |
