发明名称 |
MULTI-DIRECTIONAL TRENCHING OF A PLURALITY OF DIES IN MANUFACTURING SUPERJUNCTION DEVICES |
摘要 |
A method of manufacturing a superjunction device includes providing a semiconductor wafer having a plurality of dies. A first plurality of trenches having a first orientation are formed in a first die. A second plurality of trenches having a second orientation are formed in a second die. The second orientation is different from the first orientation.
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申请公布号 |
US2009085148(A1) |
申请公布日期 |
2009.04.02 |
申请号 |
US20080031909 |
申请日期 |
2008.02.15 |
申请人 |
ICEMOS TECHNOLOGY CORPORATION |
发明人 |
ISHIGURO TAKESHI;SUGIURA KENJI;GRIFFIN HUGH J. |
分类号 |
H01L21/764;H01L27/10 |
主分类号 |
H01L21/764 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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