MULTI-DIRECTIONAL TRENCHING OF A PLURALITY OF DIES IN MANUFACTURING SUPERJUNCTION DEVICES

摘要

A method of manufacturing a "super junction device includes providing a semiconductor wafer having a plurality of dies (320a, 321a). A first plurality of trenches (323a) having a first orientation are formed in a first die (320a). A second plurality of trenches having a second orientation are formed in a second die (321a). The second orientation is different from the first orientation.