| 摘要 |
PROBLEM TO BE SOLVED: To easily cut an adhesive sheet by using a holding frame in an optimum shape according to the shape of a structure to be segmented into individual pieces. SOLUTION: The manufacturing method includes a process of segmenting a multi-pattern wiring substrate (substrate) 20 into individual pieces. The process for the segmentation into the individual pieces includes: a step of arranging the multi-pattern wiring substrate 20 inside a holding frame 35 in predetermined position relation after preparing the holding frame 35; a step of fixing the holding frame 35 and multi-pattern wiring substrate 20 by sticking the adhesive sheet 40; and a step of cutting the adhesive sheet 40 on the surface side of the holding frame 35 where the adhesive sheet 40 is stuck. Here, a groove 38 is formed on the surface of the holding frame 35 where the adhesive sheet 40 is stuck, and the adhesive sheet 40 is cut along the groove 38 in the step of cutting the adhesive sheet 40. COPYRIGHT: (C)2009,JPO&INPIT
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