Verfahren zur Feinbehandlung eines Substrats, Verfahren zur Fertigung eines Substrats und lichtemittierende Vorrichtung

摘要

The present invention provides a method for fine processing of a substrate, a method for fabrication of a substrate, and a light emitting device. In the method for fine processing of a substrate, after removing a single particle layer from the substrate having the single particle layer, a hole having an inner diameter smaller than a diameter of a particle and centering on a position on the substrate where each particle constructing the single particle layer has been placed is formed by etching.