发明名称 METHOD OF DIVIDING BOARD AND LASER IRRADIATION APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To prevent the occurrence of cracks by plasma. <P>SOLUTION: The condensation of a pulse laser beam is controlled in a way that the energy density of the pulse laser beam is lower on the front side surface in the direction of the laser irradiation of a mother board W than the energy density generated by the plasma in the atmosphere. This prevents the plasma from being generated on the surface of the mother board W and prevents cracks from taking place. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009067612(A) 申请公布日期 2009.04.02
申请号 JP20070235054 申请日期 2007.09.11
申请人 SEIKO EPSON CORP 发明人 YAMAZAKI YUTAKA
分类号 C03B33/09;B23K26/04;B23K26/38;B23K26/40;B28D5/00 主分类号 C03B33/09
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