| 发明名称 |
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEADFRAME ARRAY |
| 摘要 |
An integrated circuit package system includes providing an integrated circuit die; attaching the integrated circuit die over a lead grid having lead blocks; and connecting a die interconnect to the integrated circuit die and the lead blocks.
|
| 申请公布号 |
US2009085177(A1) |
申请公布日期 |
2009.04.02 |
| 申请号 |
US20070862406 |
申请日期 |
2007.09.27 |
| 申请人 |
|
发明人 |
PISIGAN JAIRUS LEGASPI;PUNZALAN JEFFREY D.;TAY LIONEL CHIEN HUI;CAMACHO ZIGMUND RAMIREZ |
| 分类号 |
H01L23/495;H01L21/60 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
