| 发明名称 |
MULTI-DIRECTIONAL TRENCHING OF A DIE IN MANUFACTURING SUPERJUNCTION DEVICES |
| 摘要 |
A method of manufacturing a superjunction device includes providing a semiconductor wafer having at least one die. At least one first trench having a first orientation is formed in the at least one die. At least one second trench having a second orientation that is different from the first orientation is formed in the at least one die.
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| 申请公布号 |
US2009085147(A1) |
申请公布日期 |
2009.04.02 |
| 申请号 |
US20080031895 |
申请日期 |
2008.02.15 |
| 申请人 |
ICEMOS TECHNOLOGY CORPORATION |
发明人 |
ISHIGURO TAKESHI;SUGIURA KENJI;GRIFFIN HUGH J. |
| 分类号 |
H01L21/76;H01L27/00 |
主分类号 |
H01L21/76 |
| 代理机构 |
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