SILICON SENSING STRUCTURE TO DETECT THROUGH-PLANE MOTION A PLANE OF MATERIAL WITH THERMAL EXPANSION SUBSTANTIALLY DIFFERENT FROM THAT OF SILICON
摘要
<p>A pressure transducer is provided that has a transducer body with a rim, a diaphragm that deflects in response to pressure and a sensor bonded to the diaphragm at the rim and at a center of the diaphragm The sensor detects deflection of the metal diaphragm The sensor and diaphragm are made of different materials A thermal expansion difference between the sensor and the diaphragm is accommodated by flexures in the sensor that accept relative motion in a radial direction of the metal diaphragm with little effect on a sensitivity of the silicon structure to motion in an axial direction of the diaphragm</p>
申请公布号
WO2009043040(A1)
申请公布日期
2009.04.02
申请号
WO2008US78179
申请日期
2008.09.29
申请人
ENDEVCO CORPORATION;SUMINTO, JAMES, TJAN-MENG;WILNER, LESLIE, BRUCE