发明名称 SILICON SENSING STRUCTURE TO DETECT THROUGH-PLANE MOTION A PLANE OF MATERIAL WITH THERMAL EXPANSION SUBSTANTIALLY DIFFERENT FROM THAT OF SILICON
摘要 <p>A pressure transducer is provided that has a transducer body with a rim, a diaphragm that deflects in response to pressure and a sensor bonded to the diaphragm at the rim and at a center of the diaphragm The sensor detects deflection of the metal diaphragm The sensor and diaphragm are made of different materials A thermal expansion difference between the sensor and the diaphragm is accommodated by flexures in the sensor that accept relative motion in a radial direction of the metal diaphragm with little effect on a sensitivity of the silicon structure to motion in an axial direction of the diaphragm</p>
申请公布号 WO2009043040(A1) 申请公布日期 2009.04.02
申请号 WO2008US78179 申请日期 2008.09.29
申请人 ENDEVCO CORPORATION;SUMINTO, JAMES, TJAN-MENG;WILNER, LESLIE, BRUCE 发明人 SUMINTO, JAMES, TJAN-MENG;WILNER, LESLIE, BRUCE
分类号 G01L9/02 主分类号 G01L9/02
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