| 摘要 |
Provided is a semiconductor package wherein a semiconductor element is arranged on one surface of a base section. The base section is configured by adhering a plurality of thin plates (52, 54, 56, 58) each other and integrally bonding them. A high heat transfer element (70), which is composed of particles made of a material having heat transfer efficiency higher than that of the base section, is dispersed between two thin plates adjacent to each other among the thin plates. |
