| 摘要 |
Active cooling technologies such as thermoelectrics can be used to introduce thermal "gain" into a cooling system and, when employed in combination with forced flow liquid metal cooling loops, can provide an attractive solution for cooling high heat flux density devices and/or components. Total cooling power can be increased by employing multiple thermoelectric elements. Indeed, by employing modern semiconductor technologies, including e.g., thin-film technologies, thermoelectric elements may be cost-effectively employed and configured in large arrays.
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