| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technology for enlarging an effective area for manufacturing a semiconductor structure necessary for a semiconductor device function. <P>SOLUTION: This semiconductor device 2 has a first bonding pad 24 formed in an active region 4 and a second bonding pad 26 formed in an inactive region 6. In the case of connecting an external circuit and the semiconductor device 2 using the first bonding pad 24, a wire 14 bonded to the external circuit at its one end is bonded to the first bonding pad 24 in the semiconductor device 2. The wire 14 is further bonded to a second bonding pad 26 without being cut at the first bonding pad 24. Since the wire 14 is not cut at the first bonding pad 24, an area of the first bonding pad 24 is reduced. Thereby, a semiconductor region 8 as the effective area for manufacturing the semiconductor structure is enlarged. <P>COPYRIGHT: (C)2009,JPO&INPIT |
