| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide: a lead frame which is free of a decrease in mechanical strength of the lead frame due to corrosion of the lead frame, eliminates the need for a conventional two-stage plating process, has processes simplified, is low-cost, and neither produces a large amount of waste liquid such as plating processing liquid nor affects an environment; an electronic device having the lead frame; a method of manufacturing the lead frame; and a method of manufacturing the electronic device with the lead frame which is manufactured by the manufacturing method of the lead frame. <P>SOLUTION: The lead frame has an outer lead portion and an inner lead portion, and at least part of one of the outer lead portion and inner lead portion is plated. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
