发明名称 MULTILAYER PRINTED WIRING BOARD AND METHOD FOR FABRICATION THEREOF
摘要 Provided is a multilayer printed wiring board having a terminal portion of high quality. This multilayer printed wiring board has a flexible portion having flexibility, the flexible portion that can be bent when used, a rigid portion formed continuously with the flexible portion, the rigid portion having greater rigidity than the flexible portion, and a terminal portion formed continuously with the flexible portion at an end portion of the flexible portion. The rigid portion includes a rigid layer having insulation properties. The terminal portion includes an insulating layer formed of the same material as that for the rigid layer, the insulating layer having a conductive layer formed on the surface thereof, the conductive layer having a predetermined terminal pattern and serving as a connecting terminal.
申请公布号 US2009084583(A1) 申请公布日期 2009.04.02
申请号 US20080122211 申请日期 2008.05.16
申请人 UENO YUKIHIRO 发明人 UENO YUKIHIRO
分类号 H05K1/02;H05K3/00 主分类号 H05K1/02
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