发明名称 SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD
摘要 A substrate treating apparatus for treating substrates with treating liquids includes a treating tank for storing the treating liquids and receiving the substrates, a holding mechanism movable, while holding the substrates, between a treating position inside the treating tank and an upper position above the treating tank, a first supply device for supplying deionized water into the treating tank, a second supply device for supplying a water-soluble organic solvent in liquid form into the treating tank, a third supply device for supplying a water-insoluble organic solvent in liquid form into the treating tank, and a controller. With the holding mechanism having moved the substrates to the treating position, the controller carries out a deionized water cleaning process to clean the substrates by supplying the deionized water from the first supply device into the treating tank, treats the substrates with the water-soluble organic solvent by supplying the water-soluble organic solvent from the second supply device into the treating tank to replace the deionized water in the treating tank with the water-soluble organic solvent, treats the substrates with a mixture of the water-soluble organic solvent and water-insoluble organic solvent by supplying the water-soluble organic solvent from the second supply device into the treating tank and supplying the water-insoluble organic solvent from the third supply device into the treating tank, and thereafter moves the holding mechanism to the upper position.
申请公布号 US2009087566(A1) 申请公布日期 2009.04.02
申请号 US20080209598 申请日期 2008.09.12
申请人 KIMURA MASAHIRO 发明人 KIMURA MASAHIRO
分类号 B05D3/10;B05C11/10 主分类号 B05D3/10
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