| 摘要 |
<p>A method of manufacturing an acoustic wave device includes forming a first sealing portion (22) on a substrate (10) having an acoustic wave element thereon so that a functional region (40), in which an acoustic wave oscillates, of the acoustic wave element acts as a first non-covered portion (50) and a cutting region (42) for individuating acts as a second non-covered portion (52), forming a second sealing portion (24) on the first sealing portion so as to cover the first non-covered portion and the second non-covered portion, and cutting off the substrate and the second sealing portion so that the second non-covered portion is divided</p> |
