发明名称 DEVICE FOR TREATING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a device for treating substrates, with which the device can be small sized and suppress throughput even when untreated substrate needs to be moved back and forth between two chambers. SOLUTION: The device 11 for treating substrates includes the first chamber 15 with vacuum atmosphere and the second chamber 16 with nitrogen atmosphere. Since the first chamber 15 and the second chamber 16 have planar regular octagon shapes, when one side of each, 15a and 16a are arranged to be facing to each other, two areas A and B opening at 90°exist between the first chamber 15 and the second chamber 16. Further, in these areas A and B, the first connection room 41 and the second connection room 42, which can be communicated to the first chamber 15 and the second chamber 16 and store a multiple number of untreated substrates 12, are arranged. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009071214(A) 申请公布日期 2009.04.02
申请号 JP20070240532 申请日期 2007.09.18
申请人 SEIKO EPSON CORP 发明人 MIYAZAWA HIDEAKI
分类号 H01L21/205;C23C14/56;H01L21/02;H01L21/3065;H01L21/677 主分类号 H01L21/205
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