发明名称 METHOD OF MOUNTING CONDUCTIVE BALL AND CONDUCTIVE BALL MOUNTING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a method of mounting a conductive ball in which excessive conductive balls on a mask can be efficiently removed and conductive balls can be reliably mounted on a substrate. SOLUTION: The method of mounting conductive balls includes the steps of, disposing the mask 40 on the substrate 1 including connection pads C1, the mask 40 having opening portions 40a corresponding to the connection pad C1, supplying conductive balls 62 on the mask 40, arranging the conductive balls 62 on the connection pad C1 of the substrate 1 through the opening portions 40a of the mask 40 by moving the conductive balls 62 to one end side of the mask 40 by ball moving member 50 (a brush), and removing excess conductive balls 62 remaining on a region of the mask 40 where the opening portions 40a are provided, by bonding the excess conductive balls 62 to a ball removal film 70 (adhesive film). COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009071109(A) 申请公布日期 2009.04.02
申请号 JP20070239045 申请日期 2007.09.14
申请人 SHINKO ELECTRIC IND CO LTD 发明人 SAKAGUCHI HIDEAKI;IIDA KIYOAKI
分类号 H01L21/60 主分类号 H01L21/60
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