| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of alleviating thermal stress and also securing heat dissipation. SOLUTION: The semiconductor device includes a semiconductor element 21, a heat sink 23 for dissipating the heat generated in the semiconductor element 21, and a joint layer 25 for joining the semiconductor element 21 with the heat sink 23. The heat sink 23 includes a plurality of slits 31a and 31b which are adjacent to each other at a region with the joint layer 25 located and have different depth dimensions. COPYRIGHT: (C)2009,JPO&INPIT
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