| 摘要 |
When a photoresist or the like is spin-coated on a semiconductor chip comprising a seal ring is formed, striation due to corners of the seal ring is suppressed. A wiring metal layer and a contact are layered, and a seal structure (28) that surrounds an element forming region (22) on a semiconductor chip (20) is formed. A planar shape of the seal ring structure (28) has shape that is, at a basic level, a rectangle corresponding with the shape of the semiconductor chip (20), but with cutoffs present on corner parts (60) of the rectangle. Specifically, the seal ring structure (28) is disposed along a periphery of a rectangle having corner cutoffs.
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