ELECTRONIC COMPONENT LAMINATE, LEAD FRAME HAVING THE LAMINATE, ELECTRONIC DEVICE HAVING THE LEAD FRAME, MANUFACTURING METHOD OF ELECTRONIC COMPONENT LAMINATE, MANUFACTURING METHOD OF LEAD FRAME, AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic component laminate capable of alleviating stress from a die-bond resin, to provide a manufacturing method of a lead frame capable of stably alleviating stress from the die-bond resin, and to provide a manufacturing method of an electronic device. SOLUTION: In the electronic component laminate comprising an electronic component packaging section and an electronic component, the electronic component packaging section is joined to the electronic component by an adhesive layer, and the thickness of the adhesive layer ranges from 3 to 25 μm. COPYRIGHT: (C)2009,JPO&INPIT