| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent wires from coming into contact with each other with respect to technique for connecting bonding pads of a semiconductor chip to each other. <P>SOLUTION: The semiconductor device includes a semiconductor chip 1 having a plurality of bonding pads 3 linear arrayed, a semiconductor chip 2 having a plurality of bonding pads 4 linearly arrayed almost in parallel to the plurality of bonding pads 3, and a plurality of wires 7 connecting the bonding pads 3 and bonding pads 4 to each other individually. The bonding pads 3 and bonding pads 4 which are individually connected by the wires 7 are disposed at positions relatively shifting in the array direction. At least one of the wires 7 is curved with respect to a reference straight line S passing through the bonding pads 3 and bonding pads 4 which are individually connected by the wires 7. The curved wire extends from the bonding pads 4 in a fixed direction wherein the distance between the curved wire and a wire adjacent to the curved wire becomes larger than the distance between a reference straight line of the curved wire and a reference straight line of the adjacent wire. <P>COPYRIGHT: (C)2009,JPO&INPIT |
