发明名称 |
METHOD FOR MANUFACTURING INSULATING FILM FOR EECTRONIC DEVICE, INSULATING FILM FOR ELECTRONIC DEVICE, AND ELECTRONIC DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing an insulating film for an electronic device excellent in a dielectric constant and a mechanical strength, to provide the insulating film for the electronic device obtained by the method for manufacturing, and to provide an electronic device having the insulating film for the electronic device. SOLUTION: The method for manufacturing the insulating film for the electronic device includes the processes of: obtaining a polymer by heating a compound having a nondiamondoid structure; forming a dried film by coating and drying a coating liquid including the polymer and an organic solvent on a silicon wafer; and obtaining a film having a three-dimensional cross-linked structure by heating the dried film. The insulating film for the electronic device is obtained by the method for manufacturing. The electronic device has the insulating film for the electronic device. COPYRIGHT: (C)2009,JPO&INPIT
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申请公布号 |
JP2009070964(A) |
申请公布日期 |
2009.04.02 |
申请号 |
JP20070236579 |
申请日期 |
2007.09.12 |
申请人 |
FUJIFILM CORP |
发明人 |
WATANABE KATSUYUKI |
分类号 |
H01L21/312;C08G61/04;C09D5/25;C09D7/12;C09D145/00;C09D157/00;H01L21/768;H01L23/522 |
主分类号 |
H01L21/312 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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