| 摘要 |
The present invention includes a substrate structural body having a high electrostatic chuck force at a low voltage even when an insulated board is used, and a method for manufacturing the substrate structural body. As the substrate structural body, there is provided a substrate structural body for attaining its fixing by an electrostatic chuck mechanism, comprising at least a first polycrystalline silicon film formed on the back surface of a substrate comprised of an insulating material or its back and side surfaces, wherein a top layer of part of the back surface or the back and side surfaces is of a first silicon insulating film.
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